Analysis of Structural Stress in 88 InSb Array Detector
نویسندگان
چکیده
منابع مشابه
Analysis of Structural Stress in InSb Array Detector without Underfill
Hybrid infrared focal plane arrays (IRFPAs) are more and more used in both infrared medium and long wavebands for many different applications. In order to offer more spatial resolution, larger format (2048×2048) start to be available, yet its final yield is so low that its cost is very high, and is not affordable. In this paper, basing on viscoplastic Anand’s model, the structural stress of ind...
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Based on viscoplastic Anand’s model, the structural stress of 8 8 InSb infrared focal plane array detector with underfill is systematically analyzed by finite element method, and the impacts of design parameters including indium bump diameters, heights on both Von Mises stress and its distribution are discussed in this manuscript. Simulation results show that for the given indium bump height, t...
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ژورنال
عنوان ژورنال: The Open Electrical & Electronic Engineering Journal
سال: 2011
ISSN: 1874-1290
DOI: 10.2174/1874129001105010024